Printed circuit board with electromagnetic bandgap structure for launcher in package devices
AssigneeNXP B.V.
InventorsManuel Alfredo Monedero Miranda, Holger Kuhnert
Life of this patent
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Abstract
A Launcher in Package (LiP) device for wireless communications, e.g., radar communications at 77 GHz, includes a printed circuit board (PCB) arranged between a radio frequency (RF) chip package and a radiating antenna structure. The PCB include an electromagnetic bandgap (EBG) structure including a plurality of EBG elements printed in a periodic pattern on the side of the PCB facing the radiating antenna structure. The plurality of EBG elements border at least one side of an RF channel through the PCB that couples an antenna element of the radiating antenna structure with a corresponding RF launcher in the RF chip package.
Claims20
A printed circuit board (PCB) for a launcher in package (LiP) device, the PCB comprising:
- a first surface that faces an integrated circuit (IC) chip package of the LiP;
- a second surface that faces an antenna structure of the LiP;
- and
- an electromagnetic bandgap (EBG) structure on the second surface, the EBG structure comprising a plurality of EBG elements, wherein:
- the IC chip package includes a radio frequency (RF) IC chip package with a plurality of RF launchers;
- the antenna structure includes a plurality of antenna elements, each antenna element of the plurality of antenna elements corresponding to a respective RF launcher of the plurality of RF launchers;
- the PCB comprises a plurality of vias, each via of the plurality of vias coupling a respective antenna element of the antenna structure with a corresponding RF launcher of the plurality of RF launchers, wherein the plurality of EBG elements borders at least one side of one via of the plurality of vias.
A printed circuit board (PCB) for a launcher in package (LiP) device, the PCB comprising:
- a first surface that faces an integrated circuit (IC) chip package of the LiP, the IC chip package including a radio frequency (RF) IC package with a plurality of RF launchers;
- a second surface that faces an antenna structure of the LiP, the antenna structure includes a plurality of antenna elements, each antenna element of the plurality of antenna elements corresponding to a respective RF launcher of the plurality of RF launchers;
- a plurality of vias extending between the first surface and the second surface, each via coupling one of the plurality of RF launchers to a respective one of the plurality of antenna elements;
- an electromagnetic bandgap (EBG) structure on the second surface, the EBG structure comprising a plurality of EBG elements, each of the plurality of EBG elements borders at least one side of one via of the plurality of vias.
Dependencies are inferred from the claim text.