Heterogenous socket contact for electrical and mechanical performance scaling in a microelectronic package

An microelectronic system comprising:

• a microelectronic package containing package circuitry, and package contacts configured to provide signals and ground to the package circuitry;
• a motherboard containing motherboard circuitry and motherboard contacts configured to provide signals and ground between the motherboard circuitry and the package circuitry;
• and
• a microelectronic socket structure between the package and the motherboard and including:
• a socket structure housing defining a plurality of cavities therein;
• and
• a plurality of interconnection structures, individual ones of the interconnection structures including:
• a contact element at least in part within a corresponding one of the cavities, and electrically coupled to a corresponding one of the package contacts and the motherboard contacts, the contact element further including one of a signal contact element or a ground contact element;
• and
• a conductive structure at least in part within a corresponding one of the cavities and electrically coupled to the contact element at opposite sides of the contact element, the conductive structure having an inner contour that is non-conformal with respect to an outer contour of the contact element, the inner contour of the conductive structure facing the outer contour of the contact element.

A computing system including:

• a memory;
• and
• a processors coupled to the memory and including an microelectronic system that comprises:
• a microelectronic package containing package circuitry, and package contacts configured to provide signals and ground to the package circuitry;
• a motherboard containing motherboard circuitry and motherboard contacts configured to provide signals and ground between the motherboard circuitry and the package circuitry;
• and
• a microelectronic socket structure between the package and the motherboard and including:
• a socket structure housing defining a plurality of cavities therein;
• and
• a plurality of interconnection structures, individual ones of the interconnection structures including:
• a contact element at least in part within a corresponding one of the cavities, and electrically coupled to a corresponding one of the package contacts and the motherboard contacts, the contact element further including one of a signal contact element or a ground contact element;
• and
• a conductive structure at least in part within a corresponding one of the cavities and electrically coupled to the contact element at opposite sides of the contact element, the conductive structure having an inner contour that is non-conformal with respect to an outer contour of the contact element, the inner contour of the conductive structure facing the outer contour of the contact element.

A method of fabricating a socket structure for a microelectronic system, the method including:

• providing a cavity in a socket housing made of a dielectric material;
• providing an interconnection structure including:
• a contact element at least in part within the cavity, and to be electrically coupled to a corresponding microelectronic package, the contact element corresponding to one of a signal contact element or a ground contact element;
• and
• a conductive structure at least in part within the cavity and electrically coupled to the contact element at opposite sides of the contact element, the conductive structure having an inner contour that is non-conformal with respect to an outer contour of the contact element, the inner contour of the conductive structure facing the outer contour of the contact element.