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US 12,412,772 B2Granted
Setting up ultra-small or ultra-thin discrete components for easy assembly
AssigneeKulicke and Soffa Industries, Inc.
InventorVal Marinov
Life of this patent
Estimating the term…
Abstract
Among other things a method including releasing a discrete component from an interim handle and depositing a discrete component on a handle substrate, attaching the handle substrate to the discrete component, and removing the handle substrate from the discrete component.
Claims17
An apparatus comprising:
- a discrete component having an ultra-thin, an ultra-small, or an ultra-thin and ultra-small configuration;
- a handle substrate releasably attached to the discrete component, the handle and the discrete component having a configuration that is thicker and broader than the discrete component;
- a release layer attached to the handle substrate such that the discrete component is releasably attached to the release layer,
- wherein the release layer includes a first surface and a second surface, the first surface including one or more of a thermal-release surface and a UV release surface, the second surface including an adhesive;
- and
- a tool configured to hold the handle substrate and cause the discrete component to contact an adhesive layer on a device substrate, wherein the tool is a discrete component bonding tool configured to apply a force and temperature profile to cure the adhesive layer on the device substrate.
3 more elements
An apparatus comprising:
- a discrete component having an ultra-thin, an ultra-small, or an ultra-thin and ultra-small configuration;
- a handle substrate releasably attached to the discrete component, the handle and the discrete component having a configuration that is thicker and broader than the discrete component;
- a release layer attached to the handle substrate such that the discrete component is releasably attached to the release laver,
- wherein the release layer includes a first surface and a second surface, the first surface including one or more of a thermal-release surface and a UV release surface, the second surface including an adhesive;
- and
- a tool configured to hold the handle substrate and cause the discrete component to contact an adhesive layer on a device substrate, wherein the tool is a UV-release discrete component bonding tool configured to emit UV light with sufficient intensity to de-bond the discrete component from the handle substrate.
3 more elements
An apparatus comprising:
- a discrete component having an ultra-thin, an ultra-small, or an ultra-thin and ultra-small configuration;
- a handle substrate releasably attached to the discrete component, the handle and the discrete component having a configuration that is thicker and broader than the discrete component;
- and
- a release layer attached to the handle substrate such that the discrete component is releasably attached to the release layer,
- wherein the release layer includes a first surface and a second surface, the first surface including one or more of a thermal-release surface and a UV release surface, the second surface including an adhesive,
- in which the release layer comprises a first layer and a second layer,
- in which the second layer is thermally sensitive,
- in which the thermal sensitivity of the second layer causes a decrease in an adhesive strength in response to heat exceeding a thermal parameter of the adhesive.
5 more elements
Dependencies are inferred from the claim text.