Apparatus for treating substrate and method for treating substrate
AssigneeSemes Co., Ltd.
InventorsGui Su Park, Jun Young Choi, Young Jin Jang, Yong Sun Ko, Kyu Hwan Chang, Jun Hyun Lim
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Abstract
The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a first process treating unit configured to treat a substrate in a single-type method; a second process treating unit configured to treat a substrate in a batch-type method; and a posture changing unit provided between the first process treating unit and the second process treating unit and configured to change a posture of the substrate between a vertical posture and a horizontal posture, and wherein the substrate is loaded to and unloaded from the first process treating unit.
Claims20
A substrate treating apparatus comprising:
- a first process treating unit configured to treat a substrate in a single-type method;
- a second process treating unit configured to treat a substrate in a batch-type method;
- and
- a posture changing unit configured to transfer the substrate between the first process treating unit and the second process treating unit and to change a posture of the substrate between a vertical posture and a horizontal posture,
- wherein the posture changing unit comprises:
- a posture changing treating bath having a storage space for storing the substrate and includes at least one of a first, second, or third treating liquid;
- and
- a posture changing robot configured to discharge the substrate immersed in liquid within the storage space one by one, change the posture of the substrate from the vertical posture to the horizontal posture, and transfer the substrate to a buffer unit,
- wherein the buffer unit is configured to store the substrate in the horizontal posture.
A substrate treating apparatus comprising:
- a first process treating unit configured to treat a substrate in a single-type method;
- a second process treating unit configured to treat a plurality of substrates in a batch-type method;
- a third process treating unit configured to treat the substrate in a single-type method;
- a first posture changing unit provided between the first process treating unit and the second process treating unit and which is configured to change a posture of the substrate between a vertical posture and a horizontal posture;
- and
- a second posture changing unit provided between the second process treating unit and the third process treating unit and which is configured to change a posture of the substrate between the vertical posture and the horizontal posture,
- wherein the second process treating unit is provided between the first process treating unit and the third process treating unit,
- wherein the second process treating unit further comprises a transfer unit configured to transfer the plurality of substrates treated in the second process treating unit to the second posture changing unit,
- wherein the second posture changing unit comprises:
- a second posture changing treating bath having a storage space for storing the substrate and includes at least one of a first, second, or third treating liquid;
- and
- a second posture changing robot configured to discharge the substrate immersed in liquid within the storage space one by one, change the posture of the substrate from the vertical posture to the horizontal posture, and transfer the substrate to a second buffer unit,
- wherein the second buffer unit is configured to store the substrate in the horizontal posture.
Dependencies are inferred from the claim text.