Sensing apparatus, electronic device, and control method for electronic device

An electronic device, comprising:

• a sensing apparatus, the sensing apparatus comprising a circuit board and a plurality of control points fixed to the circuit board,
• wherein each control point of the plurality of control points is located at a different position on the circuit board, each control point comprises at least two memory alloy layers and an elastic layer, the at least two memory alloy layers and the elastic layer of each control point are superposed and fixed in a one-to-one correspondence, each memory alloy layer is connected to two electrodes, and the two electrodes are located on the circuit board, and
• wherein, when a temperature of each memory alloy layer is lower than a specified threshold, all the control points are located on a first plane, and, when a temperature of a specified memory alloy layer is higher than the specified threshold, the specified memory alloy layer and the elastic layer are deformed, and a part of a control point corresponding to the specified memory alloy layer is protruded from the first plane;
• and
• a control circuit electrically connected to the sensing apparatus, wherein the control circuit comprises a plurality of groups of input/output interfaces, the two electrodes of each memory alloy layer are electrically connected to a group of input/output interfaces of the plurality of groups of input/output interfaces in a one-to-one correspondence,
• wherein the control circuit is configured to adjust an amount of electricity of one or more of the memory alloy layers, wherein the amount of electricity controls a temperature of the memory alloy layer,
• wherein the control circuit is configured to receive to-be-transmitted information, and control, based on the to-be-transmitted information, the amount of electricity of a memory alloy layer of a first control point of the plurality of control points, so that the memory alloy layer of the first control point vibrates, and
• wherein the control circuit is further configured to control that vibration frequencies of the at least two memory alloy layers of the first control point are different.

A control method for an electronic device, the electronic device comprising a sensing apparatus, and the sensing apparatus comprising a circuit board and a plurality of control points fixed to the circuit board,

• wherein each control point of the plurality of control points is located at a different position on the circuit board, each control point comprises at least two memory alloy layers and an elastic layer, the at least two memory alloy layers and the elastic layer of each control point are superposed and fixed in a one-to-one correspondence, each memory alloy layer is connected to two electrodes, and the two electrodes are located on the circuit board, and
• wherein, when a temperature of each memory alloy layer is lower than a specified threshold, all the control points are located on a first plane, and, when a temperature of a specified memory alloy layer is higher than the specified threshold, the specified memory alloy layer and the elastic layer are deformed, and a part of a control point corresponding to the specified memory alloy layer is protruded from the first plane;
• a control circuit electrically connected to the sensing apparatus, wherein the control circuit comprises a plurality of groups of input/output interfaces, the two electrodes of each memory alloy layer are electrically connected to a group of input/output interfaces of the plurality of groups of input/output interfaces in a one-to-one correspondence,
• wherein the control circuit is configured to adjust an amount of electricity of one or more of the memory alloy layers, wherein the amount of electricity controls a temperature of the memory alloy layer,
• wherein the control circuit is configured to receive to-be-transmitted information, and control, based on the to-be-transmitted information, the amount of electricity of a memory alloy layer of a first control point, so that the memory alloy layer of the first control point vibrates, and
• wherein the control circuit is further configured to control that vibration frequencies of the at least two memory alloy layers of the first control point are different;
• wherein the method comprises:
• receiving the to-be-transmitted information;
• generating control point control information based on the to-be-transmitted information;
• and
• inputting a periodic current to the memory alloy layer of the first control point based on the control point control information, to vibrate the memory alloy layer.