Optical module and manufacturing method of optical module for optical communication

A manufacturing method of an optical module comprising:

• bonding a first block to a first face of a housing by a first adhesive;
• mounting a thermoelectric cooler (TEC) on a second face of the housing;
• preparing a chip module by assembling an integrated circuit (IC) on an interconnection board by flip-chip assembly;
• applying a second adhesive on the first block bonded on the first face of the housing, the second adhesive having a thickness larger than a thickness of the first adhesive;
• mounting an optical circuit element on the TEC mounted on the second face of the housing;
• pressing the IC against the second adhesive and mounting the chip module on the optical circuit element by flip-chip assembly, after holding the chip module at a predetermined height from one of the first face and the second face;
• and
• curing the second for bonding the IC to the first block.

A manufacturing method of an optical module comprising:

• bonding a first block to a first face of a housing by a first adhesive;
• mounting a thermoelectric cooler (TEC) on a second face of the housing;
• preparing a chip module by assembling an integrated circuit (IC) and an optical circuit element on an interconnection board by flip-chip assembly;
• applying a second adhesive on the first block bonded on the first face of the housing, the second adhesive having a thickness larger than a thickness of the first adhesive;
• applying a third adhesive on the TEC mounted on the second face of the housing;
• pressing the IC against the second adhesive and simultaneously pressing the optical circuit element against the third adhesive, after holding the chip module at a predetermined height from one of the first face and the second face;
• and
• curing the second adhesive and the third adhesive for bonding the chip module to the first block and the TEC.