Transducer, device and method for monitoring integrity of an adhesive bond
AssigneeAgency for Science, Technology and Research
InventorsZheng Zheng Wong, Kui Yao, Shuting Chen, Lei Zhang
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AssigneeAgency for Science, Technology and Research
InventorsZheng Zheng Wong, Kui Yao, Shuting Chen, Lei Zhang
Estimating the term…
A transducer for monitoring integrity of an adhesive bond between a first element and a second element, the transducer comprising: a transducing adhesive, the transducing adhesive provided to act as at least one of: an actuator to convert an electrical signal to an acoustic signal and a sensor to convert an acoustic signal to an electrical signal; and an electrode provided on the transducing adhesive, the electrode provided to perform at least one of: providing an electrical signal to the transducing adhesive and receiving an electrical signal from the transducing adhesive; wherein, in use, the transducer is provided at least partially in the adhesive bond between the first element and the second element, and the acoustic signal is passed through the adhesive bond.
A transducer for monitoring integrity of an adhesive bond between a first element and a second element, the transducer comprising:
A method of monitoring integrity of an adhesive bond between a first element and a second element, the method comprising the steps of:
Dependencies are inferred from the claim text.