Nickel electroplating compositions for rough nickel
AssigneeDupont Electronic Materials International, LLC
InventorsWeigang Wu, Fai Lung Ting
Life of this patent
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Abstract
Nickel electroplating compositions containing mercaptotetrazoles deposit rough nickel on substrates. The rough nickel can be electroplated over wide current density ranges. The rough nickel deposits enable improved adhesion to other metal layers in contrast to many conventional nickel deposits.
Claims18
A nickel electroplating composition comprising nickel ions and a mercaptotetrazole having a formula:
- wherein R1 is chosen from hydrogen, linear or branched (C1-C6)alkyl, linear or branched hydroxy (C1-C6)alkyl or salts thereof, linear or branched carboxy (C1-C6)alkyl or salts thereof, linear or branched sulfo (C1-C6)alkyl or salts thereof, and X+ is H+ or an alkali metal ion selected from the group consisting of Na+ and K+, wherein the nickel electroplating composition is free of alloying metals.
A nickel electroplating composition comprising nickel ions and a mercaptotetrazole selected from the group consisting of 5-mercapto-(1H)-tetrazolylacetic acid, sodium salt, 5-mercapto-1H-tetrazol-1-methane sulfonic acid, disodium salt and mixtures thereof, wherein the nickel electroplating composition is free of alloying metals.
A nickel electroplating composition comprising nickel ions and a mercaptotetrazole having a formula:
- wherein R1 is chosen from hydrogen, linear or branched (C1-C6)alkyl, linear or branched hydroxy (C1-C6)alkyl or salts thereof, linear or branched carboxy (C1-C6)alkyl or salts thereof, linear or branched sulfo (C1-C6)alkyl or salts thereof, linear or branched amino (C1-C6)alkyl, phenyl or benzyl, and X+ is H+, or an alkali metal ion, wherein the mercaptotetrazole is in amounts of 10 ppm to 100 ppm, wherein the nickel electroplating composition is free of alloying metals.
Dependencies are inferred from the claim text.