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US 12,410,347 B2Granted
Adhesive composition, and coverlay film and printed circuit board that include the same
AssigneeDoosan Corporation
InventorsKwangseok Park, Euidock Ryu, Inki Jeong, Subyung Park, Dongho Chae
Life of this patent
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Abstract
An adhesive composition, and a coverlay film and a printed circuit board that include the adhesive composition are disclosed. The adhesive composition includes: (a) an epoxy resin; and (b) a binder resin including epoxidized polybutadiene rubber and at least two kinds of rubber. The adhesive composition can form an adhesive layer superb in terms of adhesiveness, fluidity, filling properties (landfilling), migration resistance, heat resistance, flame retardancy, low elongation, and flexibility.
Claims18
An adhesive composition, comprising:
- (a) an epoxy resin;
- and
- (b) a binder resin including an epoxidized polybutadiene rubber and two or more species of rubber,
- wherein the two or more species of rubber comprise an acrylonitrile butadiene rubber (NBR) and an acrylic rubber.
1 more element
Dependencies are inferred from the claim text.