Organometallic adduct compound and method of manufacturing integrated circuit using the same
AssigneeSamsung Electronics Co., Ltd.
InventorsSeungmin Ryu, Jaewoon Kim, Gyuhee Park, Younjoung Cho, Kazuya Saito, Takanori Koide, Yoshiki Manabe, Yutaro Aoki, Hiroyuki Uchiuzou, Wakana Fuse
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