Substrate bonding method and substrate bonding system
AssigneesTadatomo Suga, Bondtech Co., Ltd.
InventorsAkira Yamauchi, Tadatomo Suga
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Abstract
A substrate bonding method for bonding two substrates includes an activation treatment step of, by subjecting at least one of bonding surfaces to be bonded to each other of respective ones of the two substrates to at least one of reactive ion etching using nitrogen gas and irradiation of nitrogen radicals, activating the bonding surface, a gas exposure step of, after the activation treatment step, exposing the bonding surfaces of the two substrates to gas containing water within a preset standard time, and a bonding step of bonding the two substrates that have the bonding surfaces activated in the activation treatment step.
Claims15
A substrate bonding method for bonding two substrates formed of an insulating material containing no metallic element, the method comprising:
- an activation treatment step of, by subjecting at least one of bonding surfaces to be bonded to each other of respective ones of the two substrates to at least one of etching treatment using nitrogen gas and irradiation of nitrogen radicals, bringing the bonding surface into a state where a nitrogen oxide has been formed thereon;
- a gas exposure step of, after the activation treatment step, by exposing the bonding surfaces of the two substrates to gas containing water within a preset standard time less than 10 min during which the state does not disappear, replacing the nitrogen oxide by OH groups;
- and
- a bonding step of bonding the two substrates that have the bonding surfaces on which the OH groups exist through the activation treatment step.
A substrate bonding method for bonding two substrates formed of an insulating material containing no metallic element, the method comprising:
- an activation treatment step of, by subjecting at least one of bonding surface to be bonded to each other of respective ones of the two substrates to at least one of etching treatment using nitrogen gas and irradiation of nitrogen radicals, bringing the bonding surfaces into a state where a nitrogen oxide has been formed thereon;
- a gas exposure step of, after the activation treatment step, by exposing the bonding surfaces of the two substrates to gas containing water within a preset standard time during which the state does not disappear, replacing the nitrogen oxide by OH groups;
- and
- a bonding step of bonding the two substrates that have the bonding surfaces on which the OH groups exist through the activation treatment step,
- wherein, in the bonding step, the substrate bonding method bonds the two substrates while gas pressure is greater than 1 Pa and less than 10000 Pa.
A substrate bonding method for bonding two substrates formed of an insulating material containing no metallic element, the method comprising:
- an activation treatment step of, by subjecting at least one of bonding surfaces to be bonded to each other of respective ones of the two substrates to at least one of etching treatment using nitrogen gas and irradiation of nitrogen radicals, bringing the bonding surface into a state where a nitrogen oxide has been formed thereon;
- a gas exposure step of, after the activation treatment step, by exposing the bonding surfaces of the two substrates to gas containing water within a preset standard time during which the state does not disappear, replacing the nitrogen oxide by OH groups;
- and
- a bonding step of bonding the two substrates while OH groups exist on the bonding surfaces,
- wherein, in the bonding step, the substrate bonding method bonds the two substrates under a gas pressure greater than a gas pressure in the activation treatment step.
A substrate bonding method for bonding two substrates formed of an insulating material containing no metallic element, the method comprising:
- an activation treatment step of, by subjecting at least one of bonding surface to be bonded to each other of respective ones of the two substrates to at least one of etching treatment using nitrogen gas and irradiation of nitrogen radicals, forming a nitrogen oxide on the bonding surfaces;
- a gas exposure step of, after the activation treatment step, by exposing the bonding surfaces of the two substrates to gas containing water while maintaining a state where the nitrogen oxide is formed on the bonding surfaces, replacing the nitrogen oxide formed on the bonding surfaces by OH groups;
- and
- a bonding step of bonding the two substrates while the OH groups exist on the bonding surfaces.
Dependencies are inferred from the claim text.