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US 12,409,530 B2Granted
Bonded abrasive with low wetting bond material
AssigneesSaint-Gobain Abrasives, Inc., Saint-Gobain Surface Solutions France
InventorsQing Wang, Guangyong Lin, Nilanjan Sarangi, Zhenyu Luo, Lu Lu
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Abstract
The subject application relates to bonded abrasive with low wetting bond material. An abrasive article including a bonded abrasive body having a particular MOR/EMOD ratio associated with a particular bond vol %. The body also can include a) an average Bond Post Area (BPA) of not greater than microns2; b) an average Bond Post Count (BPC) of at least 140 per 1536 mm2; c) an average bond wetting radius of at least 30/microns; or d) a combination of a) and b).
Claims10
An abrasive article comprising:
- a body comprising:
- a bond material comprising an inorganic material;
- abrasive particles contained in a bond material;
- a MOR/EMOD ratio of at least 0.92;
- a bond vol % of less than 18%, a porosity of at least 1 vol % and not greater than 65 vol %, and
- wherein the body further comprises at least one of:
- a) an average Bond Post Area (BPA) of not greater than 2400 microns2;
- b) an average Bond Post Count (BPC) of at least 140 per 1.536 mm2;
- c) an average bond wetting radius of at least 30 microns;
- and
- d) a combination of a) and b).
8 more elements
Dependencies are inferred from the claim text.