Vacuum assembly for chemical mechanical polishing
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsYu-Chen Wei, Chih-Yuan Yang, Shih-Ho Lin, Jen Chieh Lai, Szu-Cheng Wang, Chun-Jui Chu
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AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsYu-Chen Wei, Chih-Yuan Yang, Shih-Ho Lin, Jen Chieh Lai, Szu-Cheng Wang, Chun-Jui Chu
Estimating the term…
A method includes depositing a slurry onto a polishing pad of a chemical mechanical polishing (CMP) station. A workpiece is polished and polishing by-products and slurry are removed from the polishing pad by a vacuum head. A CMP apparatus includes a polishing pad configured to rotate during a CMP process. The apparatus also includes a slurry dispenser configured to deposit a slurry onto a polishing surface of the polishing pad. The apparatus further includes a momentum vacuum assembly including a slotted opening facing the polishing surface of the polishing pad. The apparatus also includes a first suction line coupled to an upper portion of the momentum vacuum assembly and leading to a first vacuum source, the first suction line configured to transport polishing products which have been removed from the polishing pad through the slotted opening.
A chemical mechanical polishing (CMP) apparatus comprising:
An apparatus comprising:
A chemical mechanical polishing (CMP) apparatus comprising
Dependencies are inferred from the claim text.