Method for producing load-indicating connection components, and corresponding load-indicating connection component

A method for producing load-indicating connection components (1), wherein a screw (10) and a piezoelectric ultrasonic transducer (20) are provided and interconnected, the method comprising:

• a) forming a layer structure on a surface (14) of the screw (10), which in this order proceeding from the surface (14) of the screw (10) comprises, a reactive layer (30), and the piezoelectric ultrasonic transducer (20),
• wherein the reactive layer (30) has a thickness in a range of 10 μm to 100 μm and is configured to melt the first solder layer (16) and the second solder layer (22) via an exothermic reaction by activation with heat, electromagnetic radiation, or electric current,
• wherein the surface (14) of the screw (10) is (i) a surface of a screw head of the screw (10) or (ii) a surface at an end of the screw opposite to the screw head,
• wherein the screw (10) is fabricated from steel, stainless steel, high-alloy steels, special steels, titanium, TiAl6V4, aluminum, nickel, amagnetic steel brass, copper, or an alloy of one of the forgoing, and
• wherein the surface (14) of the screw (10) comprises a first solder layer and a surface of the piezoelectric ultrasonic transducer (20) comprises a second solder layer;
• b) pressing the piezoelectric ultrasonic transducer (20) toward the screw (10) with a specified contact pressure;
• and
• c) activating the reactive layer (30).

A method for producing load-indicating connection components (1), wherein a screw (10) and a piezoelectric ultrasonic transducer (20) are provided and interconnected, the method comprising:

• a) forming a layer structure on a surface (14) of the screw (10), the layer structure comprising a first solder layer (16), a reactive layer (30), and the piezoelectric ultrasonic transducer (20),
• wherein the reactive layer (30) has a thickness in a range of 10 μm to 100 μm and is configured to melt the first solder layer (16) and the second solder layer (22) via an exothermic reaction by activation with heat, electromagnetic radiation, or electric current, and
• wherein the first solder layer (16) is positioned either between the surface (14) and the reactive layer (30) and a surface of the piezoelectric ultrasonic transducer (20) comprises a second solder layer or between the reactive layer (30) and the piezoelectric ultrasonic transducer (20) and the surface (14) of the screw (10) comprises the second solder layer;
• b) pressing the piezoelectric ultrasonic transducer (20) toward the screw (10) with a specified contact pressure;
• and
• c) activating the reactive layer (30).