Preparation method of copper foam
AssigneeAAC Technologies (Nanjing) Co., Ltd.
InventorsBo Zhang, Guochuang Huang
Life of this patent
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Abstract
A preparation method of copper foam includes coating copper paste on a release film to form a coating sheet with a thickness of 50-200 μm on the release film, peeling off the release film to obtain a copper foam preform after drying the release film with the coating sheet, and performing a glue discharging process on the copper foam preform and sintering the copper foam preform to obtain the copper foam having a thickness of 30-120 μm and having a porosity of 50-80%. The thickness of the copper foam is reduced, which ensures a balance between the porosity and a structural strength of the copper foam, so the copper foam has a good water absorption performance, and a heat dissipation performance of the copper foam is effectively improved.
Claims9
A preparation method of copper foam, comprising:
- coating copper paste on a release film to form a coating sheet on the release film;
- peeling off the release film to obtain a copper foam preform after drying the release film with the coating sheet;
- and
- sequentially performing a glue discharging process on the copper foam preform and sintering the copper foam preform to obtain the copper foam;
- wherein a thickness of the coating sheet range from 50-200 μm;
- a thickness of the copper foam ranges from 30-120 μm;
- a porosity of the copper foam is 50-80%;
- wherein a viscosity of the copper paste ranges from 10000-35000 cps;
- the copper paste comprises copper powder, a binder, a pore forming agent, a solvent, a tackifier, a dispersant, a leveling agent, and an antioxidant.
Dependencies are inferred from the claim text.