Substrate processing apparatus and substrate processing method
AssigneeTokyo Electron Limited
InventorsTeruhiko Kodama, Koichi Matsunaga, Hideaki Iwasaka
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AssigneeTokyo Electron Limited
InventorsTeruhiko Kodama, Koichi Matsunaga, Hideaki Iwasaka
Estimating the term…
A substrate processing apparatus that forms a friction reducing film on a rear surface of a substrate includes a processing container configured to accommodate the substrate and to define a hermetically-sealed processing space, a heating element configured to heat the rear surface of the substrate inside the processing container, a supplier configured to supply a material forming the friction reducing film toward the rear surface of the substrate inside the processing container, a first gas supplier configured to supply an inert gas to a peripheral edge of the substrate from a space above the substrate, a second gas supplier configured to supply the inert gas closer to a center of the substrate than the first gas supplier from a space above the substrate inside the processing, and an exhauster configured to exhaust an atmosphere of the processing space from a periphery or a space below the substrate.
A substrate processing apparatus that forms a friction reducing film on a rear surface of a substrate, the apparatus comprising:
A substrate processing method of forming a friction reducing film on a rear surface of a substrate inside a processing container, the method comprising:
Dependencies are inferred from the claim text.