Thermoelectric conversion module
AssigneeLintec Corporation
InventorsYuta Seki, Kunihisa Kato, Wataru Morita, Katsuhiko Horigome, Mutsumi Masumoto
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AssigneeLintec Corporation
InventorsYuta Seki, Kunihisa Kato, Wataru Morita, Katsuhiko Horigome, Mutsumi Masumoto
Estimating the term…
Provided is a thin thermoelectric conversion module provided with no support base material and including: an integrated body including an insulator configured to fill a gap defined by a chip of a P-type thermoelectric conversion material and a chip of an N-type thermoelectric conversion material, the chips being alternately arranged and spaced apart from each other; a common first electrode provided on one surface of the integrated body and joining one surface of the chip of the P-type thermoelectric conversion material and one surface of the chip of the N-type thermoelectric conversion material; and a common second electrode provided on another surface of the integrated body, facing the first electrode, and joining another surface of the chip of the N-type thermoelectric conversion material and another surface of the chip of the P-type thermoelectric conversion material, in which the first electrode and the second electrode provide electrically serial connection between the chip of the P-type thermoelectric conversion material and the chip of the N-type thermoelectric conversion material, and both surfaces of the thermoelectric conversion module are provided with no base material.
A T-type thermoelectric conversion module comprising:
Dependencies are inferred from the claim text.