Optoelectronic device and manufacturing method for an optoelectronic device

An optoelectronic device, comprising:

• a substrate;
• a stack of organic layers comprising:
• at least one active layer to serve as a light-emitting layer or a photodiode, disposed between a reflective surface or a surface of a transparent layer deposited directly on said reflective surface, and
• a semi-reflective surface disposed facing one another at a given distance and forming an optical cavity of a given optical length,
• at least three groups of pixels, each group in the at least three groups of pixels having a cavity of a different optical length, the cavity comprising a plurality of bilayers arranged between the substrate and the stack of organic layers, each bilayer being formed by a first transparent conductive layer formed of a first transparent conductive material and a second transparent conductive layer formed of a second transparent conductive material in direct contact with the first transparent conductive layer, the first transparent conductive material being different than the second transparent conductive material,
• wherein:
• for a first group of pixels in the at least three groups of pixels, the number of bilayers is zero,
• for a second group of pixels in the at least three groups of pixels, the number of bilayers is one,
• for a third group of pixels in the at least three groups of pixels, the number of bilayers is one or two, when the number of bilayers is one the first layer of the bilayer associated therewith has a thickness that is greater than a thickness of the bilayer of the second group of pixels,
• for each additional group of pixels in the at least three groups of pixels, if present, the number of bilayers increases by one with respect to a previous group or remains the same, when the number of bilayers remains the same, the first layer of the bilayer associated therewith has a thickness that is greater than a thickness of a preceding group of pixels,
• the optical length of the cavity increases in numerical order of the at least three groups of pixels,
• for each bilayer, the first conductive transparent layer, counted from the substrate, has a lower resistance to a wet etching treatment than the second conductive transparent layer, and
• for each group of pixels beyond the first group of pixels, at least said first layer of the bilayer farthest from the substrate is protected laterally by the second layer of the bilayer.