Multilayer electronic component

A multilayer electronic component comprising:

• a body including dielectric layers and internal electrodes;
• and
• external electrodes disposed on end surfaces of the body and connected to the internal electrodes,
• wherein
• at least one of the dielectric layers includes a plurality of dielectric grains,
• at least one of the plurality of dielectric grains has a core-interface shell-shell structure including an inner core region, an interface shell region including first and second interface shell regions covering at least a portion of the core region, and a shell region covering at least a portion of the interface shell region,
• the dielectric grain having the core-interface shell-shell structure includes a barium titanate (BaTiO3)-based base main component, a first subcomponent including silicon (Si), and a second subcomponent including at least one selected from the group consisting of manganese (Mn), vanadium (V), chromium (Cr), iron (Fe), nickel (Ni), cobalt (Co), copper (Cu), zinc (Zn), and tin (Sn), and
• an average content of the first subcomponent is highest in the first interface shell region, and an average content of the second subcomponent is highest in the second interface shell region.