Photosensitive resin composition, method for selecting photosensitive resin composition, method for producing patterned cured film, and method for producing semiconductor device

A method for selecting a photosensitive resin composition, the method comprising:

• exposing a resin film of a photosensitive resin composition at 100 to 2000 mJ/cm2 and heat-treating the resin film at 150° C. to 250° C. for 1 to 3 hours under nitrogen to produce a strip sample of a cured film having a film thickness of 10 μm and a width of 10 mm;
• performing a fatigue test of repeatedly pulling the strip sample under the conditions including a set temperature of −55° C., a distance between chucks of 20 mm, a testing rate of 5 mm/min, and a cyclic load stress of 120 MPa;
• and
• selecting a photosensitive resin composition satisfying the following condition:
• a number of times of pulling required until the strip sample breaks in the fatigue test is 100 or more cycles.