Stand, method of manufacturing stand, and keyboard-stand set

A method of manufacturing a stand that is configured to support an electronic apparatus in an erect state, the method comprising:

• a bonding portion formation step of providing a bonding adhesive on an inner surface of a surface material formed in a sheet shape and forming a first bonding portion and a second bonding portion, wherein the second bonding portion has a lower coating density of a bonding adhesive than that of the first bonding portion;
• a supporting portion formation step of forming a supporting portion that is configured to support a rear surface of the electronic apparatus by bonding the surface material to a plate-like member via the first bonding portion, after the bonding portion formation step;
• a flexible member formation step of forming a flexible member in a sheet shape, and which is provided along one edge of the supporting portion so as to protrude from the one edge, by bonding two surface materials via the second bonding portion, after the bonding portion formation step;
• and
• a leg portion mount step of rotatably mounting a leg portion on the supporting portion via a hinge, after the supporting portion formation step.

A keyboard-stand set comprising:

• a keyboard for wirelessly inputting to an electronic apparatus;
• and
• a stand for supporting the electronic apparatus in an erect state,
• wherein the stand includes:
• a supporting portion having a supporting surface that is configured to support a rear surface of the electronic apparatus,
• a leg portion rotatably connected to the supporting portion via a hinge,
• a flexible member in a sheet shape, that is along and protrudes from one edge of the supporting portion, and that functions as a flexible hinge which rotatably connects the stand and one edge of the keyboard,
• a surface material that is flexible and forms front surfaces of the supporting portion and of the flexible member,
• a first bonding layer that fixes the surface material onto the supporting portion, and
• a second bonding layer that has a lower coating density of a bonding adhesive than that of the first bonding layer and fixes the surface material onto the flexible member.