Thermally conductive board
AssigneeTclad Technology Corporation
InventorKuo-Chang Lo
Life of this patent
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Abstract
A thermally conductive board includes a top metal foil, a bottom metal foil, and a thermally conductive layer laminated therebetween. The thermally conductive layer includes an electrically insulation matrix and a thermally conductive filler. The electrically insulation matrix includes a fluoropolymer. The thermally conductive filler includes a glass fiber dispersed in the electrically insulation matrix. The glass fiber has a first dielectric constituent and a second dielectric constituent. The first dielectric constituent is a halogen. The total weight of the glass fiber is calculated as 100%, and the halogen accounts for at least 0.05%. The second dielectric constituent is a titanium family element. The total weight of the glass fiber is calculated as 100%, and the titanium family element accounts for at least 0.03%.
Claims16
A thermally conductive board, comprising:
- a top metal foil;
- a bottom metal foil;
- and
- a thermally conductive layer being electrically insulative, and laminated between the top metal foil and the bottom metal foil, wherein the thermally conductive layer comprises:
- an electrically insulation matrix comprising a fluoropolymer;
- and
- a thermally conductive filler comprising a glass fiber dispersed in the electrically insulation matrix, wherein the glass fiber has:
- a first dielectric constituent being a halogen, wherein the total weight of the glass fiber is calculated as 100%, and the halogen accounts for at least 0.05% by weight of the glass fiber;
- and
- a second dielectric constituent being a titanium family element, wherein the total weight of the glass fiber is calculated as 100%, and the titanium family element accounts for at least 0.03% by weight of the glass fiber.
Dependencies are inferred from the claim text.