Cured epoxy resin composition suitable for electronic device enclosure, articles, and methods
Assignee3M Innovative Properties Company
InventorsBrett A. Beiermann, John C. Clark, Eric G. Larson, Jeremy M. Higgins, Audrey S. Forticaux, Jay R. Lomeda, Wayne S. Mahoney, Scott B. Charles, Timothy D. Fletcher, Wendy L. Thompson, Kyle R. Schwartz
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