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US 12,404,363 B2Granted
Epoxy resin composition and cured product of same
AssigneeMitsubishi Gas Chemical Company, Inc.
InventorsNatsumi Nishimoto, Kazuki Kouno
Life of this patent
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Abstract
An epoxy resin composition containing an epoxy resin (A), an epoxy resin curing agent (B), a solvent (C), and an aromatic hydrocarbon formaldehyde resin (D), wherein a mass ratio of a total content of component (C) and component (D) to a total content of components (B), (C), and (D), [(C+D)/(B+C+D)], is from 0.42 to 0.57, and the mass ratio of component (C) to component (D), C/D, is 1.00 or more, and a cured product thereof.
Claims6
An epoxy resin composition comprising:
- an epoxy resin (A);
- an epoxy resin curing agent (B);
- a solvent (C);
- and
- an aromatic hydrocarbon formaldehyde resin (D),
- wherein:
- a mass ratio of a total content of component (C) and component (D) to a total content of components (B), (C), and (D), [(C+D)/(B+C+D)], is from 0.42 to 0.57, and the mass ratio of component (C) to component (D), C/D, is 1.00 or more;
- a content of the epoxy resin (A) is 30 to 70 mass % and a content of the epoxy resin curing agent (B) is 5 to 50 mass % in the epoxy resin composition;
- the epoxy resin curing agent (B) comprises a reaction composition comprising a reaction product of a polyamine compound represented by the following formula (1) and an epoxy compound having at least one epoxy group:
- H2N—CH2—A—CH2—NH2 (1)
- wherein A is a phenylene group or a cyclohexylene group;
- and
- the epoxy compound having at least one epoxy group comprises an epoxy compound containing an aromatic ring or an alicyclic structure in the molecule.
10 more elements
Dependencies are inferred from the claim text.