Output array for RF performance improvement

A device, comprising:

• a transceiver;
• and
• a power amplifier output stage coupled to the transceiver, the power amplifier output stage including:
• a first output array group comprising a first plurality of semiconductor devices;
• a first loading adjustment circuit coupled to the first output array group, the first loading adjustment circuit being configured to adjust a first loading of the first output array group to produce a first power dissipation value associated with the first output array group;
• a second output array group comprising a second plurality of semiconductor devices;
• and
• a second loading adjustment circuit coupled to the second output array group, the second loading adjustment circuit being configured to adjust a second loading of the second output array group to produce a second power dissipation value associated with the second output array group,
• wherein the first loading adjustment circuit adjusts the first loading to produce the first power dissipation value associated with the first output array group and the second loading adjustment circuit adjusts the second loading to produce the second power dissipation value associated with the second output array group to compensate for thermal coupling such that more even thermal distribution across the first output array group and the second output array group is achieved.

A power amplifier output stage comprising:

• a first output array group comprising a first plurality of semiconductor devices;
• a first output loading adjustment circuit coupled to a first output of the first output array group, the first output loading adjustment circuit being configured to adjust a first output loading of the first output array group;
• a first source loading adjustment circuit coupled to a first input of the first output array group, the first source loading adjustment circuit being configured to adjust a first source loading of the first output array group, adjusting of the first output loading and the first source loading of the first output array group producing a first power dissipation value associated with the first output array group;
• a second output array group comprising a second plurality of semiconductor devices;
• a second output loading adjustment circuit coupled to a second output of the second output array group, the second output loading adjustment circuit being configured to adjust a second output loading of the second output array group;
• and
• a second source loading adjustment circuit coupled to a second input of the second output array group, the second source loading adjustment circuit being configured to adjust a second source loading of the second output array group, adjusting of the second output loading and the second source loading of the second output array group producing a second power dissipation value associated with the second output array group,
• wherein the producing the first power dissipation value associated with the first output array group and the producing the second power dissipation value associated with the second output array group compensate for thermal coupling such that more even thermal distribution across the first output array group and the second output array group is achieved.

A method, comprising:

• adjusting a first loading of a first output array group of a power amplifier output stage to produce a first power dissipation value associated with the first output array group, the first output array group comprising a first plurality of semiconductor devices;
• and
• adjusting a second loading of a second output array group of the power amplifier output stage to produce a second power dissipation value associated with the second output array group, the second output array group comprising a second plurality of semiconductor devices,
• wherein the adjusting the first loading to produce the first power dissipation value associated with the first output array group and the adjusting the second loading to produce the second power dissipation value associated with the second output array group compensate for thermal coupling such that more even thermal distribution across the first output array group and the second output array group is achieved.