Acoustic wave device with multi-layer piezoelectric substrate with heat dissipation
AssigneeSkyworks Solutions, Inc.
InventorsKeiichi Maki, Rei Goto, Gong Bin Tang, Yosuke Hamaoka
Life of this patent
Estimating the term…
Abstract
Aspects of this disclosure relate to a filter that includes an acoustic wave device with a multi-layer substrate with heat dissipation. The multi-layer substrate includes a support substrate (e.g., a quartz substrate), a piezoelectric layer, an interdigital transducer electrode on the piezoelectric layer, and a thermally conductive layer configured to dissipate heat associated with the acoustic wave device. The thermally conductive layer is disposed between the support substrate and the piezoelectric layer. The thermally conductive layer has a thickness that is greater than 10 nanometers and less than a thickness of the piezoelectric layer.
Claims20
An acoustic wave device with heat dissipation, the acoustic wave device comprising:
- a support substrate;
- a piezoelectric layer;
- an interdigital transducer electrode on the piezoelectric layer;
- and
- a thermally conductive layer having a higher thermal conductivity than the piezoelectric layer, the thermally conductive layer positioned between the support substrate and the piezoelectric layer, and the thermally conductive layer having a thickness in a range between 10 nanometers and 120 nanometers.
A filter with heat dissipation and configured to filter a radio frequency signal, the filter comprising an acoustic wave resonator including:
- a support substrate;
- a piezoelectric layer;
- an interdigital transducer electrode on the piezoelectric layer;
- and
- a thermally conductive layer having a higher thermal conductivity than the piezoelectric layer, the thermally conductive layer positioned between the support substrate and the piezoelectric layer, the thermally conductive layer having a thickness of at least 10 nanometers and less than a thickness of the piezoelectric layer, and the filter arranged such that a maximum surface temperature of a filter chip that includes the filter is less than 60° Celsius during operation of the filter.
A method of filtering a radio frequency signal with heat dissipation, the method comprising:
- providing a radio frequency signal to a filter, the filter being a transmit filter, the filter including an acoustic wave resonator that includes a support substrate, a piezoelectric layer, an interdigital transducer electrode on the piezoelectric layer, and a thermally conductive layer having a higher thermal conductivity than the piezoelectric layer, the thermally conductive layer positioned between the support substrate and the piezoelectric layer, the thermally conductive layer having a thickness of at least 10 nanometers and less than a thickness of the piezoelectric layer;
- and
- filtering the radio frequency signal with the filter such that a maximum surface temperature of a filter chip that includes the filter is less than 60° Celsius during operation of the filter.
Dependencies are inferred from the claim text.