US 12,400,977 B2 · Integrated circuit (IC) package employing on-package tunable inductor formed in redistribution layer (RDL) for impedance tuner circuit, and related methods

Abstract

Integrated circuit (IC) package employing on-package tunable inductor formed in redistribution layer (RDL) for impedance tuner circuit, and related methods. The IC package includes an impedance tuner circuit that includes a tunable inductor that can be tuned to change the frequency response of the impedance tuner circuit. To reduce the circuit area, the tunable inductor is formed in a RDL of a package substrate of the IC package. The IC package also includes a semiconductor die (“die”) that includes other components of the impedance tuner circuit that are coupled to the tunable inductor by the die being coupled to the package substrate. In this manner, by the tunable inductor being formed in a RDL in the package substrate, the signal path lengths between the tunable inductor and other components of the tunable impedance circuit are reduced, thereby reducing inductance path resistance and improving quality (Q) factor of the tunable inductor.

Claims21

Dependent claims

An integrated circuit (IC) package, comprising:

an impedance tuner circuit, comprising:
a first switch;
a second switch;
and
an inductor comprising a first terminal and a second terminal;
a package substrate comprising a first redistribution layer (RDL) and a second RDL, the first RDL comprising the inductor;
and
a die coupled to the package substrate, the die comprising:
the first switch;
and
the second switch;
the inductor comprising:
a first metal line in the first RDL, the first metal line comprising the first terminal and the second terminal;
a first shunt tap in the first RDL, the first shunt tap coupled to the first terminal and the second terminal;
a second shunt tap in the second RDL;
a first via coupling the second shunt tap to the first terminal;
and
a second via coupling the second shunt tap to the second terminal;
the first switch coupled to the first shunt tap;
and
the second switch coupled to the second shunt tap.

18 more elements

A method of fabricating an integrated circuit (IC) package, comprising:

forming a first switch in a die;
forming a second switch in the die;
forming an inductor in a package substrate, comprising:
forming a first metal line of the inductor in a first redistribution layer (RDL) in the package substrate, the first metal line comprising a first terminal and a second terminal;
forming a first shunt tap of the inductor in the first RDL, the first shunt tap coupled to the first terminal and the second terminal;
forming a second shunt tap in a second RDL in the package substrate, the first shunt tap coupled to the first terminal and the second terminal;
forming a first via coupling the second shunt tap to the first terminal;
and
forming a second via coupling the second shunt tap to the second terminal;
coupling the die to the package substrate;
coupling the first switch to the first shunt tap;
and
coupling the second switch to the second shunt tap.

10 more elements

Dependencies are inferred from the claim text.

Integrated circuit (IC) package employing on-package tunable inductor formed in redistribution layer (RDL) for impedance tuner circuit, and related methods

Life of this patent

Integrated circuit (IC) package employing on-package tunable inductor formed in redistribution layer (RDL) for impedance tuner circuit, and related methods

Life of this patent

Abstract

Claims21