Film capacitor, film, and metallized film
AssigneeMurata Manufacturing Co., Ltd.
InventorsKazuto Yamazaki, Tomoki Inakura
Life of this patent
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Abstract
A film capacitor that includes a wound body having a dielectric film and a metal layer. When a film face positioned at an average height in the thickness direction is defined in an area range of 100 μm by 140 μm of the first main surface of the dielectric film, an area ratio of a region having a height higher than the film face by 0.05 μm or more and less than 0.20 μm is 6.04% or less, an area ratio of a region having a height higher than the film face by 0.20 μm or more and less than 2.50 μm is 0.0998% to 1.13%, and an area ratio of a region having a height higher than the film face by 2.50 μm or more is 0.100% or less.
Claims16
A film capacitor comprising:
- a wound body in which a dielectric film and a metal layer are wound, the dielectric film including a cured product of a first organic material having a hydroxy group and a second organic material that is an aromatic compound having an isocyanate group, the dielectric film including a first main surface and a second main surface opposed to each other in a thickness direction, the metal layer being disposed at least on the first main surface of the dielectric film,
- wherein the first main surface of the dielectric film includes a plurality of protrusions having the second organic material, and
- when a film face positioned at an average height in the thickness direction is defined in an area range of 100 μm by 140 μm of the first main surface of the dielectric film, an area ratio of a region having a height higher than the film face by 0.05 μm or more and less than 0.20 μm is 6.04% or less, an area ratio of a region having a height higher than the film face by 0.20 μm or more and less than 2.50 μm is 0.0998% to 1.13%, and an area ratio of a region having a height higher than the film face by 2.50 μm or more is 0.100% or less.
A film capacitor comprising:
- a wound body in which a dielectric film and a metal layer are wound, the dielectric film including a cured product of a first organic material having a hydroxy group and a second organic material that is an aromatic compound having an isocyanate group, the dielectric film including a first main surface and a second main surface opposed to each other in a thickness direction, the metal layer being disposed at least on the first main surface of the dielectric film,
- wherein the first main surface of the dielectric film includes a plurality of protrusions having the second organic material,
- a surface of the metal layer on an opposite side of the first main surface of the dielectric film includes a plurality of protruding parts coinciding with the plurality of the protrusions, and
- when a metal layer face positioned at an average height in the thickness direction is defined in an area range of 100 μm by 140 μm of the surface of the metal layer, an area ratio of a region having a height higher than the metal layer face by 0.05 μm or more and less than 0.20 μm is 6.17% or less, an area ratio of a region having a height higher than the metal layer face by 0.20 μm or more and less than 2.50 μm is 0.118% to 1.24%, and an area ratio of a region having a height higher than the metal layer face by 2.50 μm or more is 0.100% or less.
A film comprising a cured product of a first organic material having a hydroxy group and a second organic material that is an aromatic compound having an isocyanate group, and including a first main surface and a second main surface opposed to each other in a thickness direction,
- wherein the first main surface includes a plurality of protrusions having the second organic material, and
- when a film face positioned at an average height in the thickness direction is defined in an area range of 100 μm by 140 μm of the first main surface, an area ratio of a region having a height higher than the film face by 0.05 μm or more and less than 0.20 μm is 6.04% or less, an area ratio of a region having a height higher than the film face by 0.20 μm or more and less than 2.50 μm is 0.0998% to 1.13%, and an area ratio of a region having a height higher than the film face by 2.50 μm or more is 0.100% or less.
A metallized film comprising:
- a film including a cured product of a first organic material having a hydroxy group and a second organic material that is an aromatic compound having an isocyanate group, and including a first main surface and a second main surface opposed to each other in a thickness direction;
- and
- a metal layer disposed at least on the first main surface of the film,
- wherein the first main surface of the film includes a plurality of protrusions having the second organic material,
- a surface of the metal layer on an opposite side of the first main surface of the film includes a plurality of protruding parts coinciding with the plurality of the protrusions, and
- when a metal layer face positioned at an average height in the thickness direction is defined in an area range of 100 μm by 140 μm of the surface of the metal layer, an area ratio of a region having a height higher than the metal layer face by 0.05 μm or more and less than 0.20 μm is 6.17% or less, an area ratio of a region having a height higher than the metal layer face by 0.20 μm or more and less than 2.50 μm is 0.118% to 1.24%, and an area ratio of a region having a height higher than the metal layer face by 2.50 μm or more is 0.100% or less.
Dependencies are inferred from the claim text.