Method and apparatus for forming a patterned layer of material

An apparatus for forming a patterned layer of material, the apparatus comprising:

• an environment control system configured to control the composition of an environment above a substrate;
• an irradiation system;
• and
• a control system configured to control the environment control system and the irradiation system to at least:
• form a layer of a deposition-process material on the substrate by causing condensation or deposition of the deposition-process material from a gas;
• and
• irradiate a selected portion of the formed layer of deposition-process material to modify the deposition-process material in the selected portion.

An apparatus for forming a patterned layer of material, the apparatus comprising:

• an environment control system configured to control the composition of an environment above a substrate in a chamber;
• an irradiation system;
• and
• a control system configured to control the environment control system and the irradiation system to at least:
• supply a gas of deposition-process material to the chamber at a temperature higher than the substrate, a temperature difference between the substrate and the gas being such as to cause a high-density gaseous layer of deposition-process material directly to form next to the substrate, the high-density gaseous layer of deposition-process material having a higher density than the gas of deposition-process material in other regions of the chamber;
• and
• irradiate a selected portion of the formed layer of deposition-process material to modify the deposition-process material in the selected portion.