Insulation structure, insulated piping device including the same, and method of fabricating the same

An insulation structure, comprising:

• a first insulation layer on an outer surface of an insulation target;
• a second insulation layer on the first insulation layer;
• and
• a third insulation layer on the second insulation layer,
• wherein the second insulation layer includes a porous foam,
• wherein a thickness of the second insulation layer is greater than a thickness of the first insulation layer,
• wherein a thermal conductivity of the first insulation layer is less than a thermal conductivity of the second insulation layer,
• wherein a hardness of the third insulation layer is greater than a hardness of the second insulation layer, and
• wherein
• the first insulation layer includes silica aerogel,
• the second insulation layer includes an ethylene propylene diene monomer (EPDM), and
• the third insulation layer includes a polyurea-based material.

A method of fabricating an insulated device, the method comprising:

• forming a first insulation layer on an outer surface of an insulation target;
• forming a second insulation layer on the first insulation layer, the second insulation layer including a material different from a material of the first insulation layer;
• and
• forming a third insulation layer on the second insulation layer, the third insulation layer including a material different from the material of the second insulation layer,
• wherein a thickness of the second insulation layer is greater than a thickness of the first insulation layer,
• wherein the second insulation layer includes a porous foam, and
• wherein forming the first insulation layer includes taping a silica aerogel tape on the outer surface of the insulation target.