Temporary protective film for producing semiconductor device, reel body, and method for producing semiconductor device

A temporary protective film for producing a semiconductor device, the temporary protective film comprising:

• a support film;
• and
• an adhesive layer provided on one or more surfaces of the support film, the adhesive layer comprising an acrylic rubber and a peelability imparting agent,
• wherein
• the acrylic rubber is a copolymer comprising:
• a (meth)acrylic acid alkyl ester unit;
• a (meth)acrylic acid unit and/or a 2-hydroxyethyl acrylate unit;
• and
• an acrylonitrile unit as monomer units, and
• a total ratio of the monomer units is 90% by mass or more with respect to a total mass of the acrylic rubber, and
• the peelability imparting agent comprises an aliphatic epoxy compound having an aliphatic group and a glycidyl ether group bonded to the aliphatic group, and
• a content of the peelability imparting agent is between 1 part by mass and 30 parts by mass with respect to 100 parts by mass of the acrylic rubber, and
• wherein the adhesive layer is configured to have both of:
• a 90-degrees peeling strength of 5 N/m or more against a copper alloy plate as determined at 25° C. when the temporary protective film is attached to the copper alloy plate having a copper alloy surface at 25° C. so that the adhesive layer is in contact with the copper alloy surface of the copper alloy plate thereby to form a laminate;
• and
• a 90-degrees peeling strength of 150 N/m or less against the copper alloy plate as determined at 50° C. after the laminate is sequentially heated at 180° C. for 60 minutes and at 200° C. for 60 minutes.