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US 12,398,291 B2Granted
Polishing compositions and methods of use thereof
AssigneeFujifilm Electronic Materials U.S.A., Inc.
InventorsJames McDonough, Ting-Kai Huang, Yannan Liang, Shu-Wei Chang, Sung Tsai Lin, Liqing Wen
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Abstract
This disclosure features a polishing composition that includes at least one abrasive; at least one first corrosion inhibitor that includes a phosphate or a phosphonate group; at least one complexing agent; at least one second corrosion inhibitor that is at least one azole compound; and optionally a pH adjuster.
Claims21
A polishing composition, comprising:
- at least one abrasive;
- at least one first corrosion inhibitor selected from the group consisting of aromatic phosphonates, polyoxyethylene alkyl ether phosphonates, polyoxyethylene aryl alkyl ether phosphonates, polyoxyethylene nonylaryl ether phosphonates, and polyoxyethylene nonylphenyl ether phosphonates;
- at least one complexing agent;
- at least one second corrosion inhibitor, the at least one second corrosion inhibitor comprising at least one azole compound;
- and
- optionally at least one pH adjuster;
- wherein the amount of the at least one first corrosion inhibitor in the polishing composition is from about 1 ppm to about 2000 ppm of the composition and is an amount such that the polishing composition dissolves from at least about 3% by weight to at most about 10% by weight Cu2O from a solid Cu2O powder at a weight ratio of Cu2O to polishing composition of about 1:2500 when the solid Cu2O powder has an average particle size of from about 0.01 micron to about 500 microns and is immersed in the polishing composition at 25° C. for two minutes under agitation to form a mixture, the mixture is centrifuged to form a supernatant, and the amount of Cu ions dissolved in the supernatant is measured by ICP-MS.
4 more elements
A polishing composition, comprising:
- at least one abrasive;
- at least one first corrosion inhibitor selected from the group consisting of aromatic phosphonates, polyoxyethylene alkyl ether phosphonates, polyoxyethylene aryl alkyl ether phosphonates, polyoxyethylene nonylaryl ether phosphonates, and polyoxyethylene nonylphenyl ether phosphonates;
- at least one complexing agent;
- at least one second corrosion inhibitor, the at least one second corrosion inhibitor comprising at least one azole compound;
- and
- optionally at least one pH adjuster;
- wherein the amount of the at least one first corrosion inhibitor in the polishing composition is from about 1 ppm to about 2000 ppm of the composition and is in an amount such that, when a 4 cm×4 cm copper containing patterned coupon is immersed in 50 g of the polishing composition at 45° C. for 5 minutes to form a mixture, the amount of the Cu species in the mixture is from about 1 ppm to about 10 ppm as measured by ICP-MS.
4 more elements
Dependencies are inferred from the claim text.