Curing resin composition, curing method therefor, and molded article

A curable resin composition comprising:

• an acrylic monomer having a saturated group;
• a polycarbonate resin containing Structural unit (2) below which has a terminal structure represented by Structural formula (1) below with an unsaturated group attached to the end of the molecule;
• and
• a radical polymerization initiator:
• (in Formula (1),
• A represents a vinyl group, an isopropenyl group, a styryl group or a methine group,
• R1-R2 each independently represent a single bond or an optionally substituted C1-C20 alkylene group,
• R3-R4 each independently represent hydrogen, or an optionally substituted C1-C20 alkyl group, C1-C10 alkoxy group, C6-C12 aryl group or benzotriazole group,
• Z represents an ether group, a carbonyl group, an ester group or a single bond,
• a is an integer of 1-3, and
• Y represents an ether bond or an ester group);
• and
• (in Formula (2),
• R5-R8 each independently represent hydrogen, or an optionally substituted C1-C20 alkyl group, C6-C12 aryl group, C1-C5 alkoxy group or C7-C17 aralkyl group,
• b is an integer of 1 or greater,
• X is as follows:
• wherein,
• R9 and R10 each independently represent hydrogen, fluorine, chlorine, bromine or iodine, or an optionally substituted C1-C20 alkyl group, C1-C5 alkoxy group or C6-C12 aryl group, or R9 and R10 bind to each other and represent a group forming a C5-C20 carbocyclic ring or a heterocyclic ring having 5-12 elements,
• R11 and R12 each independently represent hydrogen, fluorine, chlorine, bromine or iodine, or an optionally substituted C1-C9 alkyl group, C1-C5 alkoxy group or C6-C12 aryl group,
• R13 is an optionally substituted C1-C9 alkylene group,
• c represents an integer of 0-20, and
• d represents an integer of 1-500,
• provided that the composition further comprises a second polycarbonate resin if R5-R8 are hydrogen and R9 and R10 are methyl groups),
• wherein the concentration of the acrylic monomer contained in the curable resin composition is in a range of 95-70 mass %, relative to the whole curable resin composition.