Method and device for producing an adhesive bond between a first component and a second component

Method for producing an adhesive bond between a first component and a second component for microlithography, wherein the second component is an optical element and wherein the method comprises:

• a) introducing the first component and the second component into a positioning device configured to change a relative position between the first component and the second component;
• b) calibrating a first relative position, in which a distance between the first component and the second component has a first value defining a predefined adhesive gap in forming the adhesive bond;
• c) calibrating a second relative position, in which a distance between the first component and the second component has a second value, which is greater than the first value, the second value indicating a start position in a relative adjustment of the first and second components;
• d) applying adhesive to the first component while the first component and the second component are at a distance from one another which is greater than the first value;
• and
• e) adjusting first component, starting at the start position, to the first relative position;
• and
• f) setting the first relative position while forming the adhesive bond between the first component and the second component;
• wherein both said calibrating of the first relative position and said calibrating of the second relative position are carried out before said applying of the adhesive to the first component.