Light emitting module having molding layer including light diffusion layer and black molding layer and display device having the same
AssigneeSeoul Viosys Co., Ltd.
InventorsJunhong Min, Ik Kyu You
Life of this patent
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Abstract
A method of manufacturing a light emitting module includes mounting a plurality of unit pixels on a module substrate, thermally curing a light diffusion film and a black film, laminating the light diffusion film and the black film, forming a molding layer to surround side surfaces of the plurality of unit pixels by disposing the laminated light diffusion film and the black film on the module substrate, and pressing the light diffusion film and the black film; and cutting and removing edges of the module substrate and the molding layer. The molding layer includes a light diffusion layer and a black molding layer disposed on the light diffusion layer.
Claims20
A light emitting module, comprising:
- a module substrate;
- a protection layer disposed on the module substrate and exposing portions of the module substrate and pads, the protection layer configured to block soldering of the pads and prevent an electrical short circuit between the pads;
- a plurality of unit pixels disposed on the module substrate, each unit pixel including a connection electrode electrically connected to the pads;
- and
- a molding layer covering the plurality of unit pixels, wherein:
- the molding layer further includes a light diffusion layer and a black molding layer,
- at least one of the light diffusion layer or the black molding layer includes one or more patterns, and
- a side surface of the module substrate, a side surface of the light diffusion layer, and a side surface of the black molding layer are located on a same plane.
A display apparatus, comprising:
- a display substrate;
- and
- a plurality of light emitting modules arranged on the display substrate, each of the plurality of light emitting modules including a light emitting module that comprises:
- a module substrate;
- a protection layer disposed on the module substrate and exposing portions of the module substrate and pads, the protection layer configured to block soldering of the pads and prevent an electrical short circuit between the pads;
- a plurality of unit pixels disposed on the module substrate, each unit pixel including a connection electrode electrically connected to the pads;
- and
- a molding layer covering the plurality of unit pixels, wherein:
- the molding layer further includes a light diffusion layer and a black molding layer,
- at least one of the light diffusion layer or the black molding layer includes one or more patterns, and
- a side surface of the module substrate, a side surface of the light diffusion layer, and a side surface of the black molding layer are located on a same plane.
A light emitting module, comprising:
- a module substrate;
- a plurality of unit pixels disposed on the module substrate;
- and
- a molding layer covering the plurality of unit pixels, wherein:
- the molding layer further includes a light diffusion layer and a black molding layer,
- at least one of the light diffusion layer or the black molding layer includes one or more patterns, and
- a side surface of the module substrate, a side surface of the light diffusion layer, and a side surface of the black molding layer are located on a same plane,
- wherein the light diffusion layer includes a convex portion on the plurality of unit pixels, and
- wherein the light diffusion layer further includes a first pattern,
- wherein a first interval between first elements of the first pattern on the convex portion is greater than a second interval between second elements of the first pattern, and
- wherein the second elements of the first pattern formed on an upper surface of the light diffusion layer and disposed in a region between the plurality of unit pixels.
Dependencies are inferred from the claim text.