US 12,394,748 B2 · Substrate bonding

Abstract

A method of preparing a substrate for substrate bonding is provided. The method comprises: forming a recess in a substrate surface of the substrate, and forming a bondable dielectric layer on the substrate surface of the substrate. The bondable dielectric layer has a bonding surface on an opposite side of the bondable dielectric layer to the substrate surface, wherein the recess and the bondable dielectric layer define a dielectric cavity having a dielectric cavity volume. A plug is formed configured to make electrical contact to the substrate in the dielectric cavity volume. The plug has a plug volume which is less than the dielectric cavity volume, wherein the plug extends from the dielectric cavity beyond the bonding surface in a direction generally normal to the bonding surface. The plug is coined by compressing the substrate between opposing planar surfaces such that a contact surface of the plug is made co-planar with the bonding surface.

Claims14

Dependent claims

A method of preparing a substrate for substrate bonding comprising:

forming a recess in a substrate surface of the substrate;
forming a bondable dielectric layer on the substrate surface of the substrate having a bonding surface on an opposite side of the bondable dielectric layer to the substrate surface, the recess and the bondable dielectric layer defining a dielectric cavity having a dielectric cavity volume;
forming a plug configured to make electrical contact to the substrate in the dielectric cavity volume, the plug having a plug volume which is less than the dielectric cavity volume, wherein the plug extends from the dielectric cavity beyond the bonding surface in a direction generally normal to the bonding surface;
and
coining the plug by compressing the substrate between opposing planar surfaces such that a contact surface of the plug is made co-planar with the bonding surface.

2 more elements

A method of bonding a first substrate to a second substrate comprising:

i) preparing the first substrate for bonding comprising:
forming a first recess in a first substrate surface of the first substrate;
forming a first bondable dielectric layer on the first substrate surface of the first substrate having a first bonding surface on an opposite side of the first bondable dielectric layer to the first substrate surface, the first recess and the first bondable dielectric layer defining a first dielectric cavity having a first dielectric cavity volume;
forming a first plug configured to make electrical contact to the first substrate in the first dielectric cavity volume, the first plug having a first plug volume which is less than the first dielectric cavity volume, wherein the first plug extends from the first dielectric cavity beyond the first bonding surface in a direction generally normal to the first bonding surface;
and
coining the first plug by compressing the first substrate between opposing planar surfaces;
ii) providing the second substrate for bonding, the second substrate comprising a second bondable dielectric layer and a second contact layer, provided on a second surface of the second substrate, the second contact layer having a second contact surface which is co-planar with a second dielectric surface of the second bondable dielectric layer to form a second bonding surface;
iii) aligning the first bonding surface of the first substrate opposite the second bonding surface of the second substrate such that the first plug is aligned with the second contact layer;
and
iv) bringing the first bonding surface of the first substrate into contact with the second bonding surface of the second substrate and forming a bond between the first plug and the second contact layer under compressive force.

7 more elements

Dependencies are inferred from the claim text.

Substrate bonding

Life of this patent

Substrate bonding

Life of this patent

Abstract

Claims14