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US 12,394,654 B2Granted
Wafer type sensor, wafer alignment method using the same, and calibration device for calibrating wafer type sensor
AssigneeSamsung Electronics Co., Ltd.
InventorsByung Hoon Ko, Seung Woo Noh, Sang Yun Park, Jin Woo Choi, Youn Ho Kim
Life of this patent
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Abstract
A wafer-type sensor for wafer alignment includes a dummy wafer; a sensor module disposed in the dummy wafer, and a processor configured to control the sensor module to measure a distance between a side surface of the dummy wafer and a ring formed around a periphery of an electrostatic chuck based on the dummy wafer being mounted on the electrostatic chuck by a transfer robot.
Claims18
A wafer-type sensor comprising:
- a dummy wafer;
- a plurality of sensor modules disposed in the dummy wafer;
- and
- a processor configured to control each of the plurality of sensor modules to measure a distance between a side surface of the dummy wafer and a ring formed around a periphery of an electrostatic chuck while the dummy wafer is mounted on the electrostatic chuck by a transfer robot,
- wherein the processor is further configured to:
- control each of the plurality of sensor modules to measure a first distance between the side surface of the dummy wafer and the ring, and
- control each of the plurality of sensor modules to measure a second distance between the side surface of the dummy wafer and the ring after the first distance is measured and the dummy wafer mounted on the electrostatic chuck is rotated by a predetermined degree by the transfer robot.
4 more elements
A wafer alignment method using a wafer-type sensor including a dummy wafer, the method comprising:
- measuring, by each of a plurality of sensor modules disposed in the dummy wafer, a distance between a side surface of the dummy wafer and a ring formed around a periphery of an electrostatic chuck while the dummy wafer is mounted on the electrostatic chuck by a transfer robot;
- and
- controlling the transfer robot based on the measured distance to align a wafer to be subsequently transferred,
- wherein the measuring of the distance comprises:
- measuring, by each of the plurality of sensor modules, a first distance between the side surface of the dummy wafer and the ring, and
- measuring, by each of the plurality of sensor modules, a second distance between the side surface of the dummy wafer and the ring after the first distance is measured and the dummy wafer mounted on the electrostatic chuck is rotated by a predetermined degree by the transfer robot.
3 more elements
A wafer alignment device comprising a wafer-type sensor and a robot control device,
- wherein the wafer-type sensor comprises a dummy wafer, a plurality of sensor modules disposed in the dummy wafer, each of the plurality of sensor modules being configured to measure a distance between a side surface of the dummy wafer and a ring formed around a periphery of an electrostatic chuck while the dummy wafer is mounted on the electrostatic chuck by a transfer robot, and a communication interface configured to transmit data of the measured distance to the robot control device, and
- wherein the robot control device comprises a communication interface configured to receive the data of the measured distance from the wafer-type sensor, and a processor configured to control the transfer robot based on the data of the measured distance data to align a wafer to be subsequently transferred,
- wherein the wafer-type sensor is further configured to:
- control each of the plurality of sensor modules to measure a first distance between the side surface of the dummy wafer and the ring, and
- control each of the plurality of sensor modules to measure a second distance between the side surface of the dummy wafer and the ring after the first distance is measured and the dummy wafer mounted on the electrostatic chuck is rotated by a predetermined degree by the transfer robot.
2 more elements
Dependencies are inferred from the claim text.