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US 12,394,433 B1Granted
Joining components from wafers having different pattern densities
AssigneeSeagate Technology LLC
InventorsPaula Frances McElhinney, Brendan Lafferty, Marcus Benedict Mooney
Life of this patent
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Abstract
A first set of components (e.g., recording head components) is formed on a first wafer at a first pattern density. A second set of components is formed on a second wafer at a second pattern density that is less than half that of the first pattern density. The first and second sets of components are joined to form respective subassemblies (e.g., recording head subassemblies).
Claims15
A method, comprising:
- forming a first set of recording head components on a first wafer at a first pattern density;
- forming a second set of recording head components on a second wafer at a second pattern density that is less than half that of the first pattern density;
- and
- joining the first and second set of recording head components to form respective recording head subassemblies.
1 more element
A method, comprising:
- forming a first set of recording head components on a first wafer at a first pattern density and a first part-to-part separation;
- forming a second set of recording head components on a second wafer at a second pattern density that is less than half that of the first pattern density and a second part-to-part separation that is greater than the first part-to-part separation;
- transfer printing a subset of the first set of recording head components at the second part-to-part separation to the second wafer;
- and
- joining the subset of the first set of recording head components to the second set of recording head components to form respective recording head subassemblies.
2 more elements
Dependencies are inferred from the claim text.