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US 12,393,814 B2Granted
Marking label, marking system and method for producing a marking label
AssigneeSchreiner Group GmbH & Co. KG
InventorsMartin Kluge, Melanie Achsnich, Joseph Adelsberger, Frank Willner
Life of this patent
Estimating the term…
Abstract
A marking label includes an RFID transponder with an RFID chip and an antenna structure which are coupled to one another by signal technology, and a sealing layer which covers the RFID transponder. The sealing layer is bonded to a substrate by welding so that the RFID chip and/or the antenna structure is surrounded by a weld seam and enclosed between the sealing layer and the substrate.
Claims20
A marking label (1), comprising:
- an RFID transponder (3) with an RFID chip (5) and an antenna structure (6) which are coupled to one another by signal technology, and
- a sealing layer (2, 4) formed as a flexible film element which covers the RFID transponder (3) and which is bonded to a substrate (4, 8, 13) by means of welding, so that the RFID chip (5) and/or the antenna structure (6) is surrounded by a weld seam (7) and enclosed between the sealing layer (2, 4) and the substrate (4, 8, 13).
A method for producing a marking label (1), comprising:
- providing an RFID transponder (3) with an RFID chip (5) and an antenna structure (6), which are coupled to one another by means of signal technology,
- providing a sealing layer (2, 4) formed as a flexible film element,
- attaching the RFID transponder (3) and the sealing layer (2) to a substrate (4, 8, 13) so that the RFID chip (5) and/or the antenna structure (6) is arranged between the sealing layer (2, 4) and the substrate (4, 8, 13), and
- forming a weld seam (7) by welding the sealing layer (2, 4), so that the RFID chip (5) and/or the antenna structure (6) is surrounded by the weld seam (7) and enclosed between the sealing layer (2, 4) and the substrate (4, 8, 13).
1 more element
A method for producing a marking label (1), comprising:
- providing an RFID transponder (3) with an RFID chip (5) and an antenna structure (6), which are coupled to one another by means of signal technology,
- providing a sealing layer (2, 4),
- attaching the RFID transponder (3) and the sealing layer (2) to a substrate (4, 8, 13) so that the RFID chip (5) and/or the antenna structure (6) is arranged between the sealing layer (2, 4) and the substrate (4, 8, 13),
- forming a weld seam (7) by welding the sealing layer (2, 4), so that the RFID chip (5) and/or the antenna structure (6) is surrounded by the weld seam (7) and enclosed between the sealing layer (2, 4) and the substrate (4, 8, 13), and
- performing a punching operation and/or a cutting operation and forming an outer contour of the marking label (1), wherein the welding of the sealing layer (2, 4) and the punching operation and/or the cutting operation are performed in one step.
2 more elements
Dependencies are inferred from the claim text.