Thinner composition and method of processing surfaces of semiconductor substrates
AssigneesSK hynix Inc., Tokyo Ohka Kogyo Co., Ltd.
InventorsKyung Hee Oh, Jun Kyoung Lee, Tomoya Kumagai, Motoki Takahashi
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Abstract
The present disclosure relates to a thinner composition for removing a resist and a processing method of a semiconductor substrate using the thinner composition. Particularly, the thinner composition includes (a) propylene glycol monoalkyl ether, (b) propylene glycol monoalkyl ether acetate, (c) cyclohexanone, and (d) cyclopentanone. In addition, the processing method of a semiconductor substrate includes applying a resist composition on a semiconductor substrate and removing the applied resist composition using the thinner composition of the present invention.
Claims10
A thinner composition for removing a resist comprising propylene glycol monoalkyl ether, propylene glycol monoalkyl ether acetate, cyclohexanone, and cyclopentanone,
- wherein the propylene glycol monoalkyl ether comprises from 1 wt % to 35 wt %, based on a total weight, of the thinner composition;
- wherein the propylene glycol monoalkyl ether acetate comprises from 45 wt % to 55 wt %, based on the total weight, of the thinner composition;
- wherein a total amount of the combination of the cyclohexanone and the cyclopentanone comprises from 25 wt % to 45 wt %, based on the total weight, of the thinner composition;
- and
- wherein the ratio by weight of the cyclohexanone to the cyclopentanone is between 1:0.1 and 1:10.
Dependencies are inferred from the claim text.