Adhesive composition

An adhesive composition for encapsulating an organic electronic element comprising:

• an olefin compound having at least one reactive functional group;
• a curable compound;
• a reactive diluent;
• and
• a photo-cationic initiator and a radical initiator;
• a thermosetting agent and a radical initiator;
• or a thermosetting agent and a photo-cationic initiator,
• wherein the curable compound comprises an epoxy acrylate or a urethane acrylate,
• wherein the reactive diluent has a weight average molecular weight of less than 400 and is comprised in an amount of 10 to 100 parts by weight relative to 100 parts by weight of the olefin compound,
• wherein the adhesive composition has a zero shear viscosity η0 in a range of 200 Pa·s to 18,000 Pa·s at any one shear rate of 0.02 to 50s−1 and at a temperature of 25° C., and
• wherein the adhesive composition is a solventless-type liquid at 25° C.