Encapsulation film
AssigneeLG Chem, Ltd.
InventorsEun Gu Han, So Young Kim, Seung Min Lee, Se Woo Yang
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AssigneeLG Chem, Ltd.
InventorsEun Gu Han, So Young Kim, Seung Min Lee, Se Woo Yang
Estimating the term…
The present disclosure relates to an encapsulation film and an organic electronic device comprising the same, which provides an encapsulation film having excellent resilience without causing plastic deformation, while having flexible and rollable characteristics, as well as implementing excellent moisture barrier characteristics, and an organic electronic device comprising the same. The encapsulation film includes an encapsulation composition which includes a block copolymer having a first block derived from a monomer having a glass transition temperature of 0° C. or higher, and a multifunctional oligomer, where, after the encapsulation film is stretched 200% (2 times the existing length) in the longitudinal direction under conditions of a temperature of 25° C. and 60% relative humidity and left for 24 hours, the degree of restoration at the time of removing the stretched force and measuring the length after 1 hour is within 110% of the existing length.
An encapsulation film comprising an encapsulation composition,
Dependencies are inferred from the claim text.