Cooling device semiconductor device including end curved interconnection lines

A semiconductor device, comprising:

• a substrate including a first logic cell and a second logic cell, which are adjacent to each other in a first direction and shares a cell border;
• a first metal layer on the substrate, the first metal layer comprising a power line, which is disposed on the cell border to extend in a second direction crossing the first direction and has a center line parallel to the second direction;
• and
• a second metal layer on the first metal layer,
• wherein the second metal layer comprises a first upper interconnection line of the first logic cell and a second upper interconnection line of the first logic cell provided on the first logic cell, and a first upper interconnection line of the second logic cell and a second upper interconnection line of the second logic cell provided on the second logic cell,
• the first upper interconnection lines extend along a first interconnection track and in the first direction, the first upper interconnection lines having respective curved end lines facing the center line in a plan view,
• the second upper interconnection lines extend along a second interconnection track and in the first direction, the second upper interconnection lines having respective curved end lines facing the center line in the plan view,
• the largest distance between the curved end line of the first upper interconnection line of the first logic cell and the center line in the first direction and the largest distance between the curved end line of the first upper interconnection line of the second logic cell and the center line in the first direction are a first distance,
• the smallest distance between the curved end line of the second upper interconnection line of the first logic cell and the center line in the first direction is a second distance, and
• the first distance is smaller than the second distance.