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US 12,389,569 B2Granted
Injectable heat sink
AssigneePanasonic Automotive Systems Company of America, Division of Panasonic Corporation of North America
InventorNicholas Brian Hansen
Life of this patent
Estimating the term…
Abstract
A heat sink arrangement includes a housing associated with an electronic heat source. The housing has a cavity adjacent to the heat source. A thermally conductive, electrically insulating foam heat sink is disposed in the cavity and draws heat out of the heat source. The foam heat sink may be formed of a two-part epoxy.
Claims20
A heat sink arrangement, comprising:
- an electronic assembly including:
- a high-power electronic component that produces heat during operation;
- and
- a housing containing the electronic component, the housing having a cavity;
- a first container containing a first epoxy part and a first blowing agent part;
- a second container containing a second epoxy part and a second blowing agent part;
- and
- a nozzle configured to blow a mixture of contents of the first container and contents of the second container into the cavity of the housing to thereby form a foam heat sink in the cavity for drawing heat out of the electronic component, wherein the first blowing agent part and the second blowing agent part form a blowing agent in the form of high-pressure gaseous carbon dioxide.
5 more elements
A heat sink arrangement, comprising:
- an electronic assembly including:
- a high-power electronic component that produces heat during operation;
- a housing containing the electronic component, the housing having a cavity;
- and
- an electrical contact fitting connected to the housing;
- a first container containing a first epoxy part and a first blowing agent part;
- a second container containing a second epoxy part and a second blowing agent part;
- and
- a nozzle configured to blow a mixture of contents of the first container and contents of the second container through the electrical contact fitting into the cavity of the housing to thereby form a foam heat sink in the cavity for drawing heat out of the electronic component.
6 more elements
A heat sink arrangement, comprising:
- an electronic assembly including:
- a high-power electronic component that produces heat during operation;
- and
- a housing containing the electronic component, the housing having a cavity;
- and
- a nozzle configured to blow a mixture of contents of a first container and contents of a second container into the cavity of the housing to thereby form a foam heat sink in the cavity for drawing heat out of the electronic component, wherein the first container contains a first epoxy part and a first blowing agent part, and the second container contains a second epoxy part and a second blowing agent part, wherein the first blowing agent part and the second blowing agent part form a blowing agent.
3 more elements
A heat sink arrangement, comprising:
- an electronic assembly including:
- a high-power electronic component that produces heat during operation;
- a housing containing the electronic component, the housing having a cavity;
- and
- an electrical contact fitting connected to the housing;
- and
- a nozzle configured to blow a mixture of contents of a first container and contents of a second container into the cavity of the housing through the electrical contact fitting to thereby form a foam heat sink in the cavity for drawing heat out of the electronic component.
4 more elements
A heat sink arrangement, comprising:
- an electronic assembly including:
- an electronic component that produces heat during operation;
- and
- a housing containing the electronic component, the housing having a cavity;
- and
- an electrical contact fitting connected to the housing;
- and
- a nozzle configured to blow a mixture of a two-part epoxy and a blowing agent into the cavity of the housing through the electrical contact fitting to thereby form a foam heat sink in the cavity for drawing heat out of the electronic component.
5 more elements
Dependencies are inferred from the claim text.