High frequency module and communication apparatus

A high frequency module comprising:

• a mounting board that has a first main surface and a second main surface facing each other;
• a plurality of inductors that are mounted on the first main surface of the mounting board;
• a plurality of reception filters that are mounted on the first main surface of the mounting board;
• an integrated circuit (IC) component that is mounted on the second main surface of the mounting board and that comprises a low-noise amplifier;
• and
• a transmission filter that is mounted on the first main surface of the mounting board,
• wherein each of the plurality of inductors corresponds to part of the plurality of reception filters, and is connected to a corresponding reception filter and the low-noise amplifier,
• wherein the plurality of inductors are mounted in a rectangular region that overlaps the IC component in a plan view of the mounting board,
• wherein at least one of the plurality of reception filters is closest to each of three or more sides of the rectangular region, and
• wherein at least one of the plurality of reception filters is mounted between the rectangular region and the transmission filter in the plan view.