Planar integrated circuit package interconnects
AssigneeIntel Corporation
InventorsRobert L. Sankman, Sanka Ganesan
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Abstract
Generally discussed herein are systems, methods, and apparatuses that include conductive pillars that are about co-planar. According to an example, a technique can include growing conductive pillars on respective exposed landing pads of a substrate, situating molding material around and on the grown conductive pillars, removing, simultaneously, a portion of the grown conductive pillars and the molding material to make the grown conductive pillars and the molding material about planar, and electrically coupling a die to the conductive pillars.
Claims20
An integrated circuit (IC) package, comprising:
- a substrate comprising electrical pathways;
- landing pads at a surface of the substrate;
- conductive pillars electrically connected to respective landing pads, wherein heights of the conductive pillars are within five micrometers of one another;
- and
- a die comprising contact pads electrically coupled to the electrical pathways through the conductive pillars.
A method of fabricating an integrated circuit package, the method comprising:
- forming conductive pillars on respective landing pads of a substrate;
- providing an insulating material around and on the conductive pillars;
- removing portions of the conductive pillars and the insulating material to make heights of the conductive pillars within five micrometers of one another;
- and
- providing a die electrically coupled to the conductive pillars.
An integrated circuit (IC) package, comprising:
- a substrate comprising electrical pathways;
- landing pads at a surface of the substrate;
- conductive pillars electrically connected to respective landing pads;
- a die comprising first contact pads electrically coupled to the electrical pathways through the conductive pillars;
- and
- second contact pads between the conductive pillars and the first contact pads and having widths greater than the respective landing pads.
Dependencies are inferred from the claim text.