Matched tcr joule heater designs for electrostatic chucks

A method of forming a substrate support in a substrate processing system, the method comprising:

• forming a first ceramic layer of green sheets;
• forming a bus layer on the first ceramic layer, and forming first vias in the first ceramic layer to connect the bus layer to power supply and power return lines;
• arranging a plurality of thermal elements on the first ceramic layer in one or more thermal zones, wherein each of the one or more thermal zones includes at least one of the plurality of thermal elements,
• wherein each of the plurality of thermal elements includes
• a first resistive material having a positive thermal coefficient of resistance (TCR), and
• a second resistive material having a negative TCR, wherein the second resistive material is electrically connected to the first resistive material, and a dielectric layer is formed between the first resistive material and the second resistive material;
• and
• forming a second ceramic layer of green sheets on the plurality of thermal elements, wherein a plurality of second vias are formed through the second resistive material and the dielectric layer to connect the bus layer to the first resistive material,
• wherein at least one of the first resistive material and the second resistive material of each of the plurality of thermal elements is electrically connected to a power supply via an independent pair of the power supply and power return lines, to selectively receive power from the power supply independent of other ones of the plurality of thermal elements,
• wherein, for each of the plurality of thermal elements, a corresponding one of multiple diodes is serially connected between the power supply line corresponding to the thermal element and the at least one of the first resistive material and the second resistive material, and
• wherein each of the plurality of thermal elements heats a respective one of the one or more thermal zones based on the received power.