Large-area single-crystal silver thin-film structure using single-crystal copper thin-film buffer layer and manufacturing method therefor
AssigneePusan National University Industry-University Cooperation Foundation
InventorsSe Young Jeong, Su Jae Kim, You Sil Lee
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Abstract
There are provided a large-area single-crystal silver thin-film structure using a single-crystal copper thin-film buffer layer, and a method for manufacturing same. The large-area single-crystal silver thin-film structure includes a transparent substrate; a single-crystal copper thin-film buffer layer formed by deposition on the transparent substrate; and a single-crystal silver thin-film layer deposited on the single-crystal copper thin-film buffer layer and having a certain directionality.
Claims10
A single-crystal silver thin film structure comprising:
- a transparent substrate;
- a single-crystal copper thin-film buffer layer depositedly formed on top of the transparent substrate;
- and
- a single-crystal silver thin film layer depositedly formed on the single-crystal copper thin-film buffer layer,
- wherein the single-crystal silver thin film structure is characterized by using the single-crystal copper thin-film buffer layer.
A method for manufacturing a single-crystal silver thin film structure, comprising:
- the step of forming a single-crystal copper thin-film buffer layer by applying plasma to a single-crystal copper ingot target to deposit the single-crystal copper thin-film buffer layer on a transparent substrate;
- and
- the step of forming a single-crystal silver thin-film layer by applying plasma to a single-crystal silver ingot target to deposit the single-crystal silver thin film layer on the single-crystal copper thin-film buffer layer,
- wherein the method for manufacturing the single-crystal silver thin film structure is characterized by using the single-crystal copper thin-film buffer layer.
Dependencies are inferred from the claim text.