Semiconductor device and electronic apparatus with O-ring reinforcement structure
AssigneeMurata Manufacturing Co., Ltd.
InventorYoshihiro Yoshida
Life of this patent
Estimating the term…
Abstract
A semiconductor device includes a detector mounted on a base substrate and including a pressure detector to detect pressure, a base portion on the base substrate where the detector is buried, a protruding portion protruding upward from the base portion and including an exposure hole which causes the pressure detector to be exposed upward, and a lid supported by an upper surface of the protruding portion to close the exposure hole. An outer circumferential portion of the lid extends outward from the protruding portion in plan view. The lid includes a slit that is open to an outer side surface and causes the exposure hole to communicate with outside sideward of the semiconductor device.
Claims20
A semiconductor device which detects pressure, the semiconductor device comprising:
- a base substrate;
- a detector mounted on an upper surface of the base substrate and including a pressure detector to detect pressure;
- a resin package provided on the upper surface of the base substrate, with the detector buried therein, and including a cavity which exposes the pressure detector upward;
- a lid supported by the resin package so as to close the cavity;
- and
- a communicating portion to cause the cavity to communicate with outside of the semiconductor device;
- wherein the resin package includes:
- a base portion where the detector is buried;
- and
- a protruding portion protruding upward from the base portion and including the cavity;
- in plan view, the base portion extends outward from an outer side surface of the protruding portion;
- the lid is supported by an upper surface of the protruding portion;
- the lid includes an extending portion in at least a portion of an outer circumferential portion of the lid, the extending portion extending outward from the outer side surface of the protruding portion in plan view;
- and
- the communicating portion is open sideward of the semiconductor device to communicate with outside.
Dependencies are inferred from the claim text.