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US 12,385,700 B2Granted
3D printed cold plates and methods for cooling power devices embedded in 3D printed circuit boards
AssigneeToyota Motor Engineering & Manufacturing North America, Inc.
InventorsFeng Zhou, Ercan Dede
Life of this patent
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Abstract
A method includes printing, using a 3D printer, a cold plate, printing, using a 3D printer, an electrical insulation layer embedded in a top surface of the cold plate, and printing, using a 3D printer, a conductor substrate embedded in the electrical insulation layer embedded in the top surface of the cold plate.
Claims17
A method, comprising:
- printing, using a 3D printer, as a single monolithic structure:
- a cold plate having a hollow interior recess and a plurality of fins within the hollow interior recess, and
- an electrical insulation layer embedded in a top surface of the cold plate;
- embedding a conductor substrate in the electrical insulation layer;
- and
- bonding a power device to the conductor substrate embedded in the electrical insulation layer via sintering, soldering, or utilizing a transient liquid phase (TLP) bonding process.
3 more elements
Dependencies are inferred from the claim text.